Who's Who of Top Executives

Eric T. Gelvin

Title: Member of Technical Staff for Package Development
Company: Semiconductor Components Industries, LLC
Location: Phoenix, Arizona, United States

Eric T. Gelvin, Member of Technical Staff for Package Development at Semiconductor Components Industries, LLC, has been recognized by Marquis Who’s Who Top Executives for dedication, achievements, and leadership in engineering.

With more than 25 years of experience to his credit, Mr. Gelvin has excelled as a member of the technical staff for package development with Semiconductor Components Industries LLC since 2020. Prior to this position, he served as a technical program manager for UGS America Sales Inc. from 2017 to 2020 and a value engineering manager for NXP Semiconductors from 2014 to 2017. He previously worked for Freescale Semiconductor as a global commodity manager from 2009 to 2014 and a senior packaging engineer from 2007 to 2009. He began his career as the senior quality and reliability engineer for the Intel Corporation from 1995 to 2007. Beyond his primary responsibilities, Mr. Gelvin has been active as a donor and volunteer coach with the Leukemia & Lymphoma Society as well as a member of the Institute of Electrical and Electronics Engineers (IEEE).

To support his professional ambitions, Mr. Gelvin pursued an education at the University of Alaska Fairbanks, where he completed undergraduate coursework in 1990. He continued his academic efforts at Arizona State University, from which he initially earned a bachelor’s degree in mechanical engineering in 1994 before graduating with a master’s degree in statistics in 2002. Notably, he holds a patent for paper substrates for use in integrated circuit packaging and molding processes. Attributing his success to his stellar support system from his family and his mentors, he is particularly proud of having developed excellent and strong relationships with others throughout his career. Looking toward the future, Mr. Gelvin hopes to enter a well-deserved retirement, at which point he can continue to travel, meet new people and learn about their culture.

For more information, please visit:

Contact Mr. Gelvin:

Share with:


More to explore

Joshua L. Roby

Title: Co-founder and Chief Technology Officer Company: EVRCOOL Location: Battle Creek, Michigan, United States Joshua L. Roby, co-founder and chief technology

Andrew Shajenko

Title: Software Engineer Consultant Company: Orthobotics Location: Storrs, Connecticut, United States  Andrew Shajenko, Software Engineer Consultant at Orthobotics, has been recognized

Rodger R. Creamer, ING, PE, AvMP

Title: Project Manager Company: SEAM Tech LLC Location: Venice, California, United States Rodger R. Creamer, ING, PE, AvMP, project manager at